POLYBOND-839

Equal ratio mix EPOXY adhesive

 

DESCRIPTION

PB 839 is a 100% solids epoxy system. It is a filled, thixotropic paste compound. Polybond 839 can be cured at room temperature or at elevated temperatures. It has exceptional mechanical bond, and has good adhesion to glass, ceramics, most metals, and plastics.

 

PROPERTIES - UNCURED                                        Part A                 Part B 

Color , visual .........             
Neutral
Black
Viscosity, ASTM-D-2393 (c.p.s. @ 25o C)..   
Paste
Paste
Specific Gravity ............
1.20
.99
Mix Ratio (by volume).........  
1:1
Pot Life @ 25OC (100 grams)  .....
45-60 minutes
Shelf Life @ 70o F ..........    
12 months minimum
`

 

PROPERTIES - CURED

Hardness, ASTM-D-2240(Durometer)....... 
Shore D 70
Tensile Strength, ASTM-D-638 ....... 
5,500 psi 
Tensile Elongation, ASTM-D-638 ...... 
2.8 %
Flexural Strength, ASTM-D-790.........
5,800 psi 
Water Absorption............. 
0.08%
Dielectric Strength, ASTM-D-149 (volts/mil) ...
405
Dielectric Constant, ASTM-D-150 ........ 
3
Dissipation Factor, ASTM-D-150........ 
0.002
Volume Resistivity, ASTM-D-257 (ohm-cm).....    
1 x 1014

MIXING INSTRUCTIONS 

Measure equal parts by volume (A to B - 1:1). Mix thoroughly scraping the sides and bottom of the container. Evacuate and then apply to surface.

 

CURE SCHEDULE

Room temperature cure @75°F with full properties after 24 hours.

To accelerate cure, allow 2 hours @ room temperature, then 2 hours @ 125°F.

 

General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight