POLYCAST-159

UL 94V0 RATED EPOXY COMPOUND, ROOM TEMPERATURE CURE

DESCRIPTION

PC 159 is a 100% solids epoxy system. It is a filled, low cost, general purpose epoxy encapsulant. PC 159 is designed in such a way that the mix ratio is 1:1 by volume. It is a room temperature cure, has excellent moisture resistance, and is also machine dispensable. PC 159 conforms to the UL 94V0 rating - UL File No. E164275

PROPERTIES - UNCURED                                                (Part A)                       Part B 

Color , visual .........  Black Neutral
Viscosity, ASTM-D-2393 (c.p.s. @ 25o C)..    7-10,000   5-7000
Specific Gravity .............    1.4  1.5
Mix Ratio (volume)    

1:1     

Mixed Viscosity, ASTM-D-2393 (@ 25o C) 

5-8000  

Pot Life @ 25OC (100 grams)  .....            

90 minutes

Shelf Life @ 70o F ..........   

12 months minimum

 

PROPERTIES - CURED

Hardness, ASTM-D-2240(Durometer).......    Shore D 82
Tensile Strength, ASTM-D-638 .......   8,500 psi
Tensile Elongation, ASTM-D-638 ......     6%
Flexural Strength, ASTM-D-790.........    9,500 psi
Coefficient of Thermal Expansion  ......     56 x 10-6
Heat Distortion Point.............      80°C
Water Absorption.............     0.08%
Dielectric Strength, ASTM-D-149 (volts/mil) ...       420
Dielectric Constant, ASTM-D-150 ........       3.5
Dissipation Factor, ASTM-D-150........    0.03
Volume Resistivity, ASTM-D-257 (ohm-cm).....   1 x 1015
Thermal Conductivity, (BTU*in)/(hr*ft2*ºF)...     6

MIXING INSTRUCTIONS 

Pre-mix Part A and Part B separately. Then measure 1:1 by volume (A to B).Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.

CURE SCHEDULE

Room temperature cure @75°F with full properties after 24 hours.

To accelerate cure, allow 2 hours @ room temperature, then 2 hours @ 125°F.

General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight