POLYCAST-205

EPOXY CASTING COMPOUND, ROOM TEMPERATURE CURE

DESCRIPTION

P.C.205 is a 100% solids epoxy system. It is a filled, low cost, general purpose epoxy encapsulant. Polycast 205 is designed in such a way that the mix ratio is 4:1 by volume. Room temperature. Excellent moisture resistance. Also machine dispensable.

PROPERTIES - UNCURED                                                (Part A)                       Part B 

Color , visual ......... Black Clear
Viscosity, ASTM-D-2393 (c.p.s. @ 25o C).. 7-10,000 2000
Specific Gravity ............. 1.4 1.0
Mix Ratio (volume)  

4:1

Mixed Viscosity, ASTM-D-2393 (@ 25o C)  

3-4000

Pot Life @ 25OC (100 grams)  .....  

40 minutes

Shelf Life @ 70o F ..........  

12 months minimum

 

PROPERTIES - CURED

Hardness, ASTM-D-2240(Durometer).......     Shore D 82
Tensile Strength, ASTM-D-638 .......     8,500 psi 
Tensile Elongation, ASTM-D-638 ......   6 %
Flexural Strength, ASTM-D-790.........     9,500 psi  
Coefficient of Thermal Expansion  ......   20 x 10-5
Heat Distortion Point.............    80°C
Water Absorption.............    0.08%
Dielectric Strength, ASTM-D-149 (volts/mil) ...   425
Dielectric Constant, ASTM-D-150 ........  3.6
Dissipation Factor, ASTM-D-150........      0.035
Volume Resistivity, ASTM-D-257 (ohm-cm).....    1 x 1014
Thermal Conductivity, BTU's........     6

MIXING INSTRUCTIONS 

Pre-mix Part A and Part B separately. Then measure 4:1 by volume (A to B).Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.

CURE SCHEDULE

Room temperature cure @75°F with full properties after 24 hours.

To accelerate cure, allow 2 hours @ room temperature, then 2 hours @ 125°F.

General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight