POLYCAST-240

SUPERIOR THERMAL SHOCK RESISTANT EPOXY COMPOUND

DESCRIPTION

PC 240 is a flexible unfilled epoxy resin system that exhibits low coefficient of thermal expansion and excellent shock resistance. PC 240 is suitable for use in automated dispensing equipment

PROPERTIES - UNCURED                                                (Part A)                       Part B 

Color , visual .........      Clear Clear
Viscosity, ASTM-D-2393 (c.p.s. @ 25o C)..   300 500
Specific Gravity .............     1:02 1:14
Mix Ratio (by wt.)        

100:15

Mixed Viscosity, ASTM-D-2393 (@ 25o C)   

500

Pot Life @ 25OC (100 grams)  .....      

40 minutes

Shelf Life @ 70o F ..........    

12 months

 

PROPERTIES - CURED

Hardness, ASTM-D-2240 (Durometer).......  Shore A 40 ±5
Tensile Strength, ASTM-D-638 .......    3,000 psi 
Tensile Elongation, ASTM-D-638 ......  75-100 %
Coefficient of Thermal Expansion  ......   7 x 10-6
Temperature Class ..............   B
Moisture Absorption............   0.07%
Dielectric Strength, ASTM-D-149 (volts/mil) ...  450
Dielectric Constant, ASTM-D-150 ........    4.5
Dissipation Factor, ASTM-D-150........     0.08
Volume Resistivity, ASTM-D-257 (ohm-cm).....     7 x 1012
Thermal Conductivity, BTU's........   3.5
Thermal Cycling -75ºC to 80ºC .......    Passes

MIXING INSTRUCTIONS 

Pre-mix Part A and Part B separately. Then measure 100:15 parts by weight (A to B). Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.

CURE SCHEDULE

Room temperature cure @75°F for 24 hours.

Post cure @ 250ºF for 2 hours.


General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight