POLYCAST 254 Low Viscosity Filled Epoxy Compound DESCRIPTION: Polycast 254 is a low viscosity, filled epoxy formulation which is used for encapsulation and embedment of electronic components. It has excellent electrical properties and exceptional adhesion to most substrates. PC 254 is 100% solids.
MIXING INSTRUCTIONS: 1. Premix P.C. 254 in the original container prior to use to insure any settled filler may be reincorporated. Warming PC 254 to 100°F facilitates ease of use. 2. Weigh out the required amount of P.C.254 Part A and the requisite Part B. 3. Mix thoroughly, scraping both sides and bottom of container. 4. Evacuate mixture at 29 in. Hg for 5-10 minutes (if desired). 5. Pour into mold or cavity. CURE SCHEDULE: Overnight at Room temp. (75°F) CAUTION: Good housekeeping rules are always important. Provide ample ventilation in all areas of handling, mixing and use. Avoid prolonged breathing of possible fumes. Minimize skin contact. Use of goggles, rubber gloves and protective creams is recommended. Always wash exposed areas immediately using warm water and soap, followed by rinsing with clear water. If material comes in contact with eyes, flush with clean water for 15 minutes and consult a physician immediately. All data given in this bulletin is based on our own research and research of others. They are believed to be accurate, however, no guarantee of accuracy is made. Product described is sold without warranty, except conformity to specifications, and on condition that purchasers shall determine suitability for their particular purpose. |
