POLYCAST   280

High Thermal Conductivity Epoxy Casting Compound

DESCRIPTION:

Polycast 280 is a low viscosity, highly filled, epoxy formulation which, in addition to having excellent electrical properties, has high thermal conductivity and low thermal expansion. PC-280 is available in a thixotropic version for dipping applications.

PROPERTIES - UNCURED:	Part A	Part B (PC 90)	Part B (PC 67)
Color, Visual	Black	Amber	Brown
Viscosity, cps.	100,000	400	500	ASTMD2393
Specific Gravity	2.30	1.0	1.0
Mix Ratio (By Weight)		100:5-6	100:7-8
Mixed Viscosity, cps.		75,000	75,000	ASTMD2393
Pot Life @ 72o F, hours		1	4
Shelf Life @ 72o F, months		12	12
PROPERTIES - CURED:
Hardness Durometer (Shore D)		91	92	ASTMD 2240
Tensile Strength, psi		8000	8500	ASTMD 638
Tensile Elongation, %		1	1	ASTMD 638
Compressive Strength, psi		16,500	19,000	ASTMD 695
Flexural Strength, psi		11,500	13,000	ASTMD 790
Coefficient of Thermal Expansion (cm/cm/°C)		40 x 10-6	24 x 10-6
Heat Distortion Point		150°C	150°C
Dielectric Strength, volts/mil		450	475
Dielectric Constant, 60 Hz		6.2	6.4	ASTMD 150
Dissipation Factor, 60 Hz		0.02	0.02	ASTMD 150
Volume Resistivity, ohm-cm		1.3 x 1015	5 x 1015	ASTMD 257
Thermal Conductivity, BTU (in)/(hr)(ft2 )(°F)		10	10

                                     

MIXING INSTRUCTIONS:

1.       Premix P.C. 280 in the original container prior to use to insure any settled filler may be reincorporated. Warming PC 280 to 100°F facilitates ease of use.

2.       Weigh out the required amount of P.C.280 Part A and the requisite Part B.

3.       Mix thoroughly, scraping both sides and bottom of container.

4.       Evacuate mixture at 29 in. Hg for 5-10 minutes (if desired).

5.       Pour into mold or cavity.

CURE SCHEDULE:                                                 

PC-90 - Room Temp. - 24 hrs. or 2 hours at 150°F.

PC-67 - Overnight at 125°F; or 2 hours at 200^o F; or 1 hour at 250^oF

NOTE: For service temperature above 300°F, post cure 2-3 hours at 325-350°F.

 

General Purpose PC-100: Low Cost General Purpose PC-125: Low viscosity potting and casting. PC-133: Flame retardant casting PC-135: Machinable. PC-159: Flame retardant UL94V-0 rated. PC-205: Low viscosity version of 159. PC-266: Version of 159 meeting MIL-1-6923. PC-290:Room Temp. Cure PC-510: Low Viscosity, Clear Casting

Thermally Conductive PC-100: Low Cost General Purpose PC-140: Castable Heat Sink, UL94v0. PC-240: Superior resistance. PC-280: Best balance of properties. PC-282: Twice the conductivity of PC-280 with lower viscosity. PC-287: Highest thermal conductivity. PC-571: One Component, Rigid PC-581: One Component, Flexible PC-582: Flexible Heat Cure PC-8300: Single Component, Casting Sand

Special Epoxies PC-ALUM: Aluminum filled PG-30: Room Temp Epoxygel PG-50: Flexible Epoxy gel PC-220: Electrically conductive PC-250: Soft, flexible epoxy PC-254: Low Viscosity Filled PC-270: Aluminum Filled PC-517: Adhesive Flexible PC-601: Very low viscosity PC-610: Optically clear PC-661: Lightweight PC-685: Superior thermal shock resistance PB-839: Equal Ratio Adhesive PC-8500: Single Component, Lightweight