POLYCAST-661 LIGHT WEIGHT SYNTACTIC EPOXY COMPOUND DESCRIPTIONPC 661 is a low density epoxy system. It exhibits a low dielectric constant and low shrinkage. PC 661 is suitable for use in lightweight and airborne equipment. It finds use in applications where thermal insulation is required.
MIXING INSTRUCTIONSPre-mix Part A and Part B separately. Then measure 100:15 parts by weight (A to B). Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity. CURE SCHEDULERoom temperature cure @75°F for 24 hours. To accelerate cure: cure 1 hour @ 75ºF, then @ 200ºF for 2 hours. CAUTION: Good housekeeping rules are always important. Provide ample ventilation in all areas of handling, mixing and use. Avoid prolonged breathing of possible fumes. Minimize skin contact. Use of goggles, rubber gloves and protective creams is recommended. Always wash exposed areas immediately using warm water and soap, followed by rinsing with clear water. If material comes in contact with eyes, flush with clean water for 15 minutes and consult a physician immediately. All data given in this bulletin is based on our own research and research of others. They are believed to be accurate, however, no guarantee of accuracy is made. Product described is sold without warranty, except conformity to specifications, and on condition that purchasers shall determine suitability for their particular purpose.
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