PC-685
Superior thermal shock resistance

PC-685 Superior thermal shock resistance

Superior thermal shock resistance. Ideal for encapsulation of aerospace power supplies.


PC-685 Features:

Filled  
Service Temperature (C): -40 to 130
Rigid, Black  
Initial mixed viscosity: 40,000 cps
Specific gravity: 1.4
Hardness scale: 75D
Compressive strength: 10,000 psi
Linear shrinkage, cm/cm, in/in: .001
Thermal conductivity: :2.0
Coefficient of thermal expansion: 50x10 (-6)
Dielectric strength: 425 v/mil
Dielectric constance @ 1000Hz: 4.0
Disipation factor @ 1000Hz: .03
Volume resistivity, ohm*cm: 10 (15)
Moisture absorbtion %, 7-days: 0.8

 

General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight