POLYCAST 8300

Single-Component EPOXY Casting Sand COMPOUND

DESCRIPTION

PC 8300 is an epoxy coated material designed for casting & potting. It is designed so that there is no advance preparation before use. It has high thermal conductivity and helps dissipate heat around electrical components.

PROPERTIES - UNCURED  
Color , visual .............. Green
Filler content % ............. 91-95 
Appearance...............   Dry sand granules
Specific gravity............  2.45 
Particle size............. <0.09
Shelf Life @ 70o F ..........    6 months
PROPERTIES - CURED
 
Moisture Absorption (24 hrs) . . . .. . . . 0.51
Linear Shrinkage . . . . . . . . . . . . . . . 0.24
Thermal Conductivity (cal x cm2/sec x cm °C). 9.1 x 10-4
Fill Volume . . . . . . . . . . . . . . . .   >60%
Dielectric Constant, ASTM-D-150 ........ 4.2
Dissipation Factor, ASTM-D-150....... . 0.13
Volume Resistivity, ASTM-D-257 (ohm-cm). 2.1 x 1014

 

APPLICATION INSTRUCTIONS 

PC 8300 handles like dry granular sand. Fill around the parts to be potted. Any lumps may easily be broken. Vibration may be used to help fill small voids in the material.

CURE SCHEDULE

Standard cure: 4 hrs. @ 150°C.

Alternate method: 8 hrs. @ 125°C.

All data given in this bulletin is based on our own research and research of others.  They are believed to be accurate, however, no guarantee of accuracy is made.  Product described is sold without warranty, except conformity to specifications, and on condition that purchasers shall determine suitability for their particular purpose.

 

General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight