POLYGEL-30

ROOM TEMPERATURE CURING FLEXIBLE EPOXY GEL

DESCRIPTION

Polygel 30 is a flexible unfilled epoxy resin system. It is transparent and cures at room temperature. Polygel 30 is very low in viscosity and normally does not require vacuum degassing to assure bubble-free casting and embedments. It may also be used in automated dispensing equipment.

 

PROPERTIES   Part A Part B 
Color , visual .........    Clear  Clear
Viscosity, ASTM-D-2393 (c.p.s. @ 25o C)..   500 700
Specific Gravity .............   1.05 0.98
Mix Ratio (by wt.) . . .. . . . . . .     100:25    
Mixed Viscosity, ASTM-D-2393 (@ 25o C)  520    
Pot Life @ 25OC (100 grams)  ..... 60-90 minutes    
Shelf Life @ 70o F ..... . .... 12 months    
Hardness, ASTM-D-2240 (Durometer).... .. . Shore A 30    
Tensile Strength, ASTM-D-638 . . . . . . . 350 psi    
Tensile Elongation, ASTM-D-638 . . . . . .  160 %    
Coefficient of Thermal Expansion  . . . . . . 30 x 10-6    
Moisture Absorption . . . . . . . . . . . . 0.08%    
Dielectric Strength, ASTM-D-149 (volts/mil) ... 375    
Dielectric Constant, ASTM-D-150 ..... . . . 3.5    
Dissipation Factor, ASTM-D-150..... . . . 0.03    
Volume Resistivity, ASTM-D-257 (ohm-cm)..... 1 x 1014    

 

MIXING INSTRUCTIONS 

Pre-mix Part A and Part B separately. Then measure 100:25 parts by weight (A to B). Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.

CURE SCHEDULE

Room temperature cure @75°F for 24 hours.

Post cure @ 250ºF for 2 hours.

 

General Purpose
PC-100: Low Cost General Purpose
PC-125: Low viscosity potting and casting.
PC-133: Flame retardant casting
PC-135: Machinable.
PC-159: Flame retardant UL94V-0 rated.
PC-205: Low viscosity version of 159.
PC-266: Version of 159 meeting MIL-1-6923.

PC-290:Room Temp. Cure
PC-510: Low Viscosity, Clear Casting

Thermally Conductive
PC-100: Low Cost General Purpose
PC-140
: Castable Heat Sink, UL94v0.
PC-240: Superior resistance.
PC-280: Best balance of properties.
PC-282: Twice the conductivity of PC-280 with lower viscosity.
PC-287: Highest thermal conductivity.

PC-571: One Component, Rigid
PC-581: One Component, Flexible
PC-582: Flexible Heat Cure
PC-8300: Single Component, Casting Sand

Special Epoxies
PC-ALUM: Aluminum filled
PG-30: Room Temp Epoxygel
PG-50: Flexible Epoxy gel
PC-220: Electrically conductive
PC-250: Soft, flexible epoxy
PC-254: Low Viscosity Filled
PC-270: Aluminum Filled

PC-517: Adhesive Flexible
PC-601: Very low viscosity
PC-610: Optically clear
PC-661: Lightweight

PC-685: Superior thermal shock resistance

PB-839: Equal Ratio Adhesive
PC-8500: Single Component, Lightweight