UL 94V0 RATED EPOXY COMPOUND, ROOM TEMPERATURE CURE
DESCRIPTION
PC 159 is a 100% solids epoxy system. It is a filled, low cost, general purpose epoxy encapsulant. PC 159 is designed in such a way that the mix ratio is 1:1 by volume. It is a room temperature cure, has excellent moisture resistance, and is also machine dispensable. PC 159 conforms to the UL 94V0 rating - UL File No. E164275
PROPERTIES - UNCURED (Part A) Part B
| Color , visual ......... |
Black |
Neutral |
| Viscosity, ASTM-D-2393 (c.p.s. @ 25o C).. |
7-10,000 |
5-7000 |
| Specific Gravity ............. |
1.4 |
1.5 |
| Mix Ratio (volume) |
1:1
|
| Mixed Viscosity, ASTM-D-2393 (@ 25o C) |
5-8000
|
| Pot Life @ 25OC (100 grams) ..... |
90 minutes
|
| Shelf Life @ 70o F .......... |
12 months minimum
|
PROPERTIES - CURED
| Hardness, ASTM-D-2240(Durometer)....... |
Shore D 82 |
| Tensile Strength, ASTM-D-638 ....... |
8,500 psi |
| Tensile Elongation, ASTM-D-638 ...... |
6% |
| Flexural Strength, ASTM-D-790......... |
9,500 psi |
| Coefficient of Thermal Expansion ...... |
56 x 10-6 |
| Heat Distortion Point............. |
80°C |
| Water Absorption............. |
0.08% |
| Dielectric Strength, ASTM-D-149 (volts/mil) ... |
420 |
| Dielectric Constant, ASTM-D-150 ........ |
3.5 |
| Dissipation Factor, ASTM-D-150........ |
0.03 |
| Volume Resistivity, ASTM-D-257 (ohm-cm)..... |
1 x 1015 |
| Thermal Conductivity, (BTU*in)/(hr*ft2*ºF)... |
6 |
MIXING INSTRUCTIONS
Pre-mix Part A and Part B separately. Then measure 1:1 by volume (A to B).Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.
CURE SCHEDULE
Room temperature cure @75°F with full properties after 24 hours.
To accelerate cure, allow 2 hours @ room temperature, then 2 hours @ 125°F.
