LIGHT WEIGHT SYNTACTIC EPOXY COMPOUND
DESCRIPTION
PC 661 is a low density epoxy system. It exhibits a low dielectric constant and low shrinkage. PC 661 is suitable for use in lightweight and airborne equipment. It finds use in applications where thermal insulation is required.
| PROPERTIES - UNCURED |
(Part A) |
Part B |
| Color , visual ......... |
White |
Clear |
| Viscosity, ASTM-D-2393 (c.p.s. @ 25o C).. |
30,000 |
500 |
| Specific Gravity ............. |
0.75 |
1.14 |
| Mix Ratio (by wt.) |
100:12 |
|
| Mixed Viscosity, ASTM-D-2393 (@ 25o C) |
10,000 |
|
| Pot Life @ 25OC (100 grams) ..... |
30 minutes |
|
| Shelf Life @ 70o F .......... |
12 months |
|
| PROPERTIES - CURED |
|
| Hardness, ASTM-D-2240 (Durometer)....... |
Shore D 82 |
| Compressive Strength............ |
12,000 |
| Tensile Strength, ASTM-D-638 ....... |
4,000 psi |
| Tensile Elongation, ASTM-D-638 ...... |
5% maximum |
| Flexural Strength ASTM-D-790 . ....... |
4,200 psi |
| Coefficient of Thermal Expansion ...... |
55 x 10-6 |
| Moisture Absorption............. |
0.08% |
| Dielectric Strength, ASTM-D-149 (volts/mil).... |
375 |
| Dielectric Constant, ASTM-D-150 ........ |
3.3 |
| Dissipation Factor, ASTM-D-150........ |
0.01 |
| Volume Resistivity, ASTM-D-257 (ohm-cm)..... |
1 x 1012 |
| Thermal Conductivity, BTU's........ |
1.3 |
MIXING INSTRUCTIONS
Pre-mix Part A and Part B separately. Then measure 100:15 parts by weight (A to B). Mix thoroughly scraping the sides and bottom of the container. Evacuate and then pour into mold or cavity.
CURE SCHEDULE
Room temperature cure @75°F for 24 hours.
To accelerate cure: cure 1 hour @ 75ºF, then @ 200ºF for 2 hours.
